TOKYO — During the Semicon Japan trade show here today, nLine Corp. rolled out its first product–a wafer inspection tool, based on a new and radical holographic imaging technology. The new ...

Rising at an 11.30% CAGR, the market is fueled by gate-all-around architectures, EUV process challenges, and the shift from sampling to exhaustive inline inspection NEWARK, DE / ACCESS Newswire / ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different ...

MILPITAS, Calif., July 10, 2018 /PRNewswire/ -- Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...

Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...

France-based company Unity-SC, which specializes in optical inspection tools for semiconductor wafer production, says that its new system will be able to increase yields in laser diode manufacturing.

MILPITAS, Calif., July 20, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the revolutionary eSL10™ e-beam patterned-wafer defect inspection system. The new system is designed to ...

Wafers produced for products as diverse as LEDs and MP3 players vary greatly in function, but they have one thing in common: They often undergo optical inspection after they pass an electrical test.

Semiconductor wafers serve as the foundational substrate for microelectronic devices, yet their production is prone to a variety of surface and subsurface defects that compromise yield and reliability ...