Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...

A new technique measures free-form wafer shape, write Marco Franchi, Wooptix, and Leon van Dijk, Ronald Otten, Richard Van Haren, ASML. On-product overlay (OPO) is one of the most critical parameters ...

The precision required poses several challenges for testing and packaging procedures, necessitating the precise alignment of fiber optic devices in high-throughput production settings. PI offers ...

Semiconductor manufacturing depends heavily on the ability of machine-vision systems to correctly locate, identify, and align wafers and circuits for testing. Inaccuracy in any of these activities can ...

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer ...