A high-yield, known-good stack requires multiple test insertions. Known good stack testing poses challenges for power delivery and thermal management. The shift to HBM4 and HBM5 will increase the ...
The emergence of 3-D ICs presents test challenges that extend from design-for-test tools from design-automation companies to device handlers from equipment firms including Advantest and Multitest. A ...
October 13, 2013. Delft University of Technology (TU Delft) and nanoelectronics research center imec have presented 3D-COSTAR, a new test-flow cost-modeling tool for 2.5/3D stacked integrated circuits ...
Wafer inspection has become a critical part of the semiconductor manufacturing process. Inspections performed after wafer test can analyze the marks left by probe cards to ensure that the test process ...
As shrinking die size has caused a reduction in the size of bond pads used as contacts during electrical testing, there is less room for error in the electrical ...
In this interview, Jeremy Hope from Wentworth Laboratories talks to AZoM about why they are attending electronica. Please tell us about the company Wentworth Labs and why you are attending electronica ...
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