MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261 , a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB ...
Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...
Imec and EV Group (EVG) demonstrate a highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad ...
FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES1 product line of photosensitive insulating materials, including ...
Semiconductor substrate warpage and signal loss now have a Korean challenger to glass: Viacore and Aqlaser’s low-CTE polyimide substrate and molecular bonding process claim 40% lower manufacturing ...
Wafer bonding underpins the integration of diverse semiconductor materials into unified platforms, enabling three-dimensional stacking and heterogeneous assembly of components with disparate lattice ...
Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...
SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the ...
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