Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher ...
Kemet Corp. has added the company’s KONNEKT high-density packaging technology to its family of KC-LINK capacitor range to meet growing demand in wide-bandgap (WBG) semiconductors, electric ...
Leading edge consumer electronic products drive demand for enhanced performance and small form factors. This in turn drives manufacturing requirements for all aspects of semiconductor device ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...
The void fraction, an important powder packing property, directly impacts many of the powder's physical characteristics and applications. To demonstrate how the variation in powder particle size ...
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