Jiun Jiang Enterprise Co., Ltd. (JJ Enterprise) is a Taiwan-based engineering and manufacturing company specializing in the design, development, and production of precision industrial equipment, ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Korea University of Technology and Education (KOREATECH) will receive 10 billion won in government funding to establish ...

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

As countries race to secure semiconductor supply chains, UST's Gilroy Mathew says India's biggest opportunity lies in chip ...

Designing energy-efficient systems that meet the high bandwidth demands of high-performance computing (HPC) involves key trends in silicon technology: increasing transistor density, enhancing memory ...

When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

According to Mordor Intelligence, the global semiconductor bonding market is projected to grow from USD 1.19 billion in ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Three OSAT facilities are operational in Gujarat's Sanand. ThePrint visited two of them, & found engineering graduates running precision machines alongside international veterans.