Indium Corporation announces the Heat-Spring®metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTMIGBT modules. Many ...

Learn more about Indium Corporation’s precision Au-based preforms and meet the company experts at IMS 2026, booth 21054.

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...

As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation ® will feature its advanced products designed to meet the evolving challenges of ...