To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...
A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
Kyocera is bringing out a multilayer ceramic core substrate for semiconductor packages which are rapidly scaling in complexity as AI datacenter architectures evolve. Built from Kyocera’s proprietary ...
Silicon nitride ceramic substrates play a pivotal role in Active Metal Brazing (AMB) substrates for power modules whose applications include inverters for electric vehicle (EV) and hybrid electric ...
KYOTO, Japan--(BUSINESS WIRE)--Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor ...
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