The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...

A new technical paper titled “Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication” was published by researchers at Korea University and Georgia Institute of Technology. “As ...

Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment ...

Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for Samsung's SF2Z manufacturing technology Ansys solutions enable early adopters to reliably design leading-edge ...

TSMC introduced its 1.2nm- and 1.3nm-class processes, A12 and A13, both targeted for production in 2029, along with an unexpected extension of the N2 family, N2U.

(a) Integration schematic of an n-TSV in BSPDN architecture; (b) high-AR n-TSV array configuration; (c) calculated thermal stress mappings in n-TSVs with (i) vertical and (ii) tapered sidewalls.