The next big leap in CPU design won’t come from adding more cores, chasing smaller nodes, or stacking additional chiplets onto one CPU. That's not to say that things like AMD's 3D V-Cache aren't good, ...

Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment ...

(a) Integration schematic of an n-TSV in BSPDN architecture; (b) high-AR n-TSV array configuration; (c) calculated thermal stress mappings in n-TSVs with (i) vertical and (ii) tapered sidewalls.