Nasdaq

Ansys Multiphysics Solutions Certified By TSMC For High-Speed Next-Generation 3D-IC Packaging Technologies

Ansys (NASDAQ: ANSS) achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS® with silicon interposer (CoWoS®-S) and InFO with RDL interconnect (InFO-R) ...
Yahoo Finance

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

Existing Ansys capabilities with NVIDIA Omniverse platform supercharge 3D integrated circuit (3D-IC) design by enabling designers to optimize semiconductor chips within the context of a ...
Nasdaq

Ansys Multiphysics Solutions Certified for Samsung Foundry's Entire Line of FinFET Process Technologies

Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes Ansys® RedHawk-SC™ was added to the certified suite to design ...
Seeking Alpha

Ansys Works with Supermicro and NVIDIA to Deliver Unmatched Multiphysics Simulation with Turnkey Hardware

PITTSBURGH, Pa., July 18, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) is collaborating with Supermicro and NVIDIA to deliver turnkey hardware, enabling unmatched acceleration for Ansys multiphysics ...
Yahoo Finance

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...