Old camera tech has been employed to form a 3D hybrid of NAND and DRAM tech using IGZO instead of silicon.
At the recent Flash Memory Summit (FMS) 2022 the engineering team at YMTC have unveiled its latest X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. YMTC’s Xtacking 3.0 architecture ...
For several decades, NAND Flash has been the primary technology for low-cost and large-density data storage applications. This non-volatile memory is present in all major electronic end-use markets, ...
SAN JOSE, Calif.--(BUSINESS WIRE)--NEO Semiconductor™, the developer of innovative X-NAND™ architecture, today announced the company has been granted two U.S. patents under the title “Methods and ...
Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...
A new research paper titled “Impact of Stacking-Up and Scaling-Down Bit Cells in 3D NAND on Their Threshold Voltages” was published by researchers at Sungkyunkwan University and Korea University.
CEO Andy Hsu will introduce new applications and variations for 3D NAND flash and 3D DRAM, including a new AI application called "Local Computing", drastically increasing AI chip performance to a new ...
A technical paper titled “3D NAND Flash Memory Cell Current and Interference Characteristics Improvement With Multiple Dielectric Spacer” was published by researchers at Myongji University, Soongsil ...
Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...
There is a growing demand for higher-density NAND flash across the global storage market. For the time being, this demand has been satisfied through many developments, not only in the capabilities of ...
On Monday, memory and storage vendor Micron announced that its new 176-layer 3D NAND (the storage medium underlying most SSDs) process is in production and has begun shipping to customers. The new ...
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